- AutorIn
- Sebastian Killge Institute of Semiconductor and Microsystems Technology (IHM),Technische Universität Dresden
- Sujay CharaniaInstitute of Semiconductor and Microsystems Technology (IHM), Technische Universität Dresden
- Niels NeumannChair for Radio Frequency and Photonics Engineering, Technische Universität Dresden
- Zaid Al-Husseini
- Dirk Plettemeier
- Johann W. Bartha
- Ronny Henker
- Frank Ellinger
- Titel
- Modeling and characterization of optical TSVs
- Zitierfähige Url:
- https://nbn-resolving.org/urn:nbn:de:bsz:14-qucosa2-351483
- Konferenz
- 17th Conference on Optical Fibres and Their Applications. Supraśl, 23.-27. January 2017
- Quellenangabe
- Optical Fibers and Their Applications 2017
Herausgeber: Jan Dorosz, Ryszard S. Romaniuk
Erscheinungsort: Bellingham, Wash.
Verlag: SPIE
Erscheinungsjahr: 2017
Titel Schriftenreihe: Proceedings of SPIE
Bandnummer Schriftenreihe: 10325 - Erstveröffentlichung
- 2017
- Abstract (EN)
- In future, computing platforms will invoke massive parallelism by using a huge number of processing elements. These elements need broadband interconnects to communicate with each other. Following More-than-Moore concepts, soon large numbers of processors will be arranged in 3D chip-stacks. This trend to stack multiple dies produces a demand for high-speed intraconnects (within the 3D stack) which enable an efficient operation. Besides wireless electronic solutions (inductive or capacitive as well as using antennas), optical connectivity is an option for bit rates up to the Tbit/s range, too. We investigated different candidates for optical TSVs. For optical transmission via optical Through-Silicon-Vias, we were able to demonstrate negligible losses and dispersion.
- Andere Ausgabe
- Link zum Artikel, der zuerst in der Zeitschrift 'Proceedings of SPIE' erschienen ist.
DOI: 10.1117/12.2270994 - Freie Schlagwörter (DE)
- integrierte Optoelektronik, Multichip-Module, Through-Silizium-Vias
- Freie Schlagwörter (EN)
- integrated optoelectronics, multichip modules, through-silicon vias
- Klassifikation (DDC)
- 620
- Verlag
- SPIE, Bellingham, Wash.
- Förder- / Projektangaben
- European Social Fund Atto3D
- German Research Foundation Highly Adaptive Energy-Efficient Computing
- European Social Fund 3DCSI
- Version / Begutachtungsstatus
- publizierte Version / Verlagsversion
- URN Qucosa
- urn:nbn:de:bsz:14-qucosa2-351483
- Veröffentlichungsdatum Qucosa
- 06.09.2019
- Dokumenttyp
- Konferenzbeitrag
- Sprache des Dokumentes
- Englisch
- Lizenz / Rechtehinweis