- AutorIn
- Martin Schubert Electronics Packaging Laboratory, Technische Universität Dresden, Germany
- Yakun WangElectronics Packaging Laboratory, Technische Universität Dresden, Germany
- Mykola VinnichenkoFraunhofer Institute for Ceramic Technologies and Systems IKTS Dresden, Germany
- Marco Fritsch
- Lars Rebohle
- Thomas Schumann
- Karlheinz Bock
- Titel
- Evaluation of Nanoparticle Inks on Flexible and Stretchable Substrates for Biocompatible Application
- Zitierfähige Url:
- https://nbn-resolving.org/urn:nbn:de:bsz:14-qucosa2-331476
- Konferenz
- 7th Electronic System-Integration Technology Conference (ESTC). Dresden, Germany, 18-21 Sept. 2018
- Quellenangabe
- 7th Electronic System-Integration Technology Conference (ESTC)
Erscheinungsort: New York
Verlag: Institute of Electrical and Electronics Engineers (IEEE
Erscheinungsjahr: 2018
DOI: 10.1109/ESTC.2018.8546494 - Erstveröffentlichung
- 2018
- Abstract (DE)
- The flexible and stretchable electronic market is increasing particularly in the field of biomedical electronics. Widely used printed silver conductive tracks today are only eligible for on-skin applications. However, for biomedical applications fully biocompatible, flexible and even stretchable materials for device fabrication are needed. This paper presents an additive printing approach to fabricate flexible and stretchable electronics by using a biocompatible platinum material. Usually, in order to realize electrically conducting Ptinterconnects by inkjet printing, it requires a furnace sintering at prohibitively high temperatures, which are not compatible with thermal sensitive polymeric substrates. This paper describes a high-power diode laser sintering (HPDL) and a flash lamp annealing (FLA) as promising alternative sintering methods. Both processes are eligible whereas laser sintering showed slightly better results. Bending tests and adhesive strength tests of platinum printed inks on polyimide with up to 180 000 cycles, show that printed platinum is a suitable biocompatible material for flexible electronics.
- Andere Ausgabe
- Link zum Artikel, der zuerst in '7th Electronic System-Integration Technology Conference (ESTC)' erschienen ist.
Link: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8546494
DOI: 10.1109/ESTC.2018.8546494 - Freie Schlagwörter (DE)
- Tinte, Substrate, Platin, Silber, Immunsystem, Kunststoffe, Polyimide
- Freie Schlagwörter (EN)
- Ink, Substrates, Platinum, Silver, Immune system, Plastics, Polyimides
- Klassifikation (DDC)
- 610
- Klassifikation (RVK)
- XA 10000
- Verlag
- Institute of Electrical and Electronics Engineers (IEEE), New York, NY
- Sonstige beteiligte Institution
- Technische Universität Dresden, Dresden
- Version / Begutachtungsstatus
- publizierte Version / Verlagsversion
- URN Qucosa
- urn:nbn:de:bsz:14-qucosa2-331476
- Veröffentlichungsdatum Qucosa
- 11.02.2019
- Dokumenttyp
- Konferenzbeitrag
- Sprache des Dokumentes
- Englisch
- Lizenz / Rechtehinweis