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Dielectric strength of insulating material in LN2 with thermally induced bubbles

  • To realize a reliable and cost-effective application of high-temperature superconductive (HTS) equipment at high-voltage (HV) levels, the influence of thermally induced gas bubbles on the dielectric strength of different solid insulating materials in liquid nitrogen (LN2) was investigated. A heatable copper tape electrode arrangement was developed simulating HTS tapes with insulation in between. AC breakdown measurements were performed without and with forced boiling on insulating papers, polypropylene laminated paper (PPLP) and polyimide (PI) films. Under nucleate boiling the influence of bubbles on the dielectric strength of all materials was not significant. However under film boiling the dielectric strength of the insulating papers decreased to a level comparable to their dielectric strength in air, demonstrating the insufficient impregnation of porous materials under film boiling. For PI there was no degradation at all. PPLP retained about 70% of its basic dielectric strength in LN2.

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Author:Dirk Gromoll, Ralph Schumacher, Christof Humpert
URN:urn:nbn:de:hbz:832-epub4-19795
DOI:https://doi.org/10.1088/1742-6596/1559/1/012087
ISSN:1742-6588
ISSN:1742-6596
Parent Title (English):Journal of Physics: Conference Series
Publisher:IOP Publishing
Document Type:Article
Language:English
Date of first Publication:2020/06/01
Date of Publication (online):2022/06/27
Volume:1559
Issue:1
Page Number:11
Institutes:Informations-, Medien- und Elektrotechnik (F07) / Fakultät 07 / Institut für Elektrische Energietechnik
Dewey Decimal Classification:500 Naturwissenschaften und Mathematik
Open Access:Open Access
DeepGreen:DeepGreen
Licence (German):License LogoCreative Commons - CC BY - Namensnennung 4.0 International