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The Effect of Freestream Flow Velocities on the Flexible Printed Circuit Board with Different BGA Package Arrangements

  • Research Article - Mechanical Engineering
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Abstract

The desire of flexibility, light weight and low cost in current electronic device has increased the application of flexible printed circuit board (FPCB). This paper aims to investigate the effect of different Reynolds number (Re) toward FPCB attached with ball grid array (BGA) package in different arrangements. Actual BGA package with 100 solder joints incorporating FPCB was attached to a fixture in wind tunnel test section to perform FPCB’s deflection analysis with different flow velocities and package’s configurations. Furthermore, numerical simulation was also performed to obtain numerical deflection and stress value. The findings show that the Reynolds numbers have a substantial effect to the FPCB’s deflection and stress. However, the BGA package’s positions on the FPCB were found to be insignificant to the responses. The actual BGA package on FPCB as presented in this paper will represent more realistic values of determined FPCB’s deflection and stress.

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Abbreviations

FPCB:

Flexible printed circuit board

Re :

Reynolds number

BGA:

Ball grid array

RPCB:

Rigid printed circuit board

CFD:

Computational fluid dynamic

FSI:

Fluid-structure interaction

\({\vec {u}}\) :

Flow velocity

\(\rho \) :

Air density

V :

Air velocity

L :

Characteristic length

\(\mu \) :

Dynamic viscosity

\(\delta \) :

Deflection

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Authors and Affiliations

  1. School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Penang, Malaysia

    C. H. Lim

  2. School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Penang, Malaysia

    M. Z. Abdullah

  3. Mechanical Section, Universiti Kuala Lumpur Malaysian Spanish Institute, Kulim Hi-TechPark, 09000, Kulim, Kedah, Malaysia

    I. A. Azid

  4. Faculty of Engineering Technology (FETech), Universiti Malaysia Perlis (UniMAP), Level 1, Block S2, UniCITI Alam Campus, Sungai Chuchuh, 02100, Padang Besar, Perlis, Malaysia

    C. Y. Khor

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  1. C. H. Lim
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  4. C. Y. Khor
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Correspondence to C. H. Lim.

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Lim, C.H., Abdullah, M.Z., Azid, I.A. et al. The Effect of Freestream Flow Velocities on the Flexible Printed Circuit Board with Different BGA Package Arrangements. Arab J Sci Eng 42, 2075–2086 (2017). https://doi.org/10.1007/s13369-017-2491-5

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  • DOI: https://doi.org/10.1007/s13369-017-2491-5

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