Bitte benutzen Sie diese Referenz, um auf diese Ressource zu verweisen: doi:10.22028/D291-38319
Titel: Analysis and evaluation of bundled SMA actuator wires
VerfasserIn: Britz, Rouven
Motzki, Paul
Sprache: Englisch
Titel: Sensors and Actuators A: Physical
Bandnummer: 333 (2022)
Verlag/Plattform: Elsevier
Erscheinungsjahr: 2021
Freie Schlagwörter: Shape Memory Alloys
SMA
Bundle
Ni-Ti
NiTi
Nitinol
High Force
Actuator
DDC-Sachgruppe: 500 Naturwissenschaften
Dokumenttyp: Journalartikel / Zeitschriftenartikel
Abstract: The attractive properties of shape memory alloys (SMA), especially their high energy density, steadily expand the range of applications in which SMA wires represent attractive alternative actuator components. Industrial applications in particular, oftentimes require large forces, which scale with the diameter of SMA actuator wires. The higher the required actuator force, the larger the total effective cross-sectional area of the SMA wires is needed. Increasing the SMA wire diameter results in worse actuator dynamics due to a decreasing surface-to-volume ratio and thus slower convective cooling. Instead of simply increasing the wire diameter, the bundling of several thin wires offers a suitable alternative to generate higher forces. This results in an increased surface-to-volume ratio and thus permits higher dynamic system performance. This paper discusses the mechanical and thermal behavior of SMA wire bundles and shows the influence of contact resistance inside the clamps, which is important to optimize for a long-lasting functionality of SMA bundles. In addition, the experiments show an indirect heating between single SMA wires inside a bundle, which leads to an energy saving capability up to 60%. Two electro-mechanical experiments show the behavior of SMA bundles in a constant force and a constant strain measurement. The experimental results show a maximum stroke of 4–4.5% and a generated maximum force of 1200 N. The results are discussed to provide an understanding of the mechanical characteristics of SMA bundles. In addition, an infrared (IR)-Camera provides an insight into the thermal behavior.
DOI der Erstveröffentlichung: 10.1016/j.sna.2021.113233
URL der Erstveröffentlichung: http://dx.doi.org/10.1016/j.sna.2021.113233
Link zu diesem Datensatz: urn:nbn:de:bsz:291--ds-383190
hdl:20.500.11880/34577
http://dx.doi.org/10.22028/D291-38319
ISSN: 0924-4247
Datum des Eintrags: 30-Nov-2022
Fakultät: NT - Naturwissenschaftlich- Technische Fakultät
Fachrichtung: NT - Systems Engineering
Professur: NT - Keiner Professur zugeordnet
Sammlung:SciDok - Der Wissenschaftsserver der Universität des Saarlandes

Dateien zu diesem Datensatz:
Datei Beschreibung GrößeFormat 
1-s2.0-S0924424721006968-main.pdf8,33 MBAdobe PDFÖffnen/Anzeigen


Diese Ressource wurde unter folgender Copyright-Bestimmung veröffentlicht: Lizenz von Creative Commons Creative Commons