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Connecting silicon photonic circuits to multicore fibers by photonic wire bonding

Lindenmann, Nicole 1,2; Dottermusch, Stephan 1,2; Goedecke, Maria Laura 1,2; Hoose, Tobias 1,2; Billah, Muhammad Rodlin 1,2; Onanuga, Temitope Paul 1,2; Hofmann, Andreas ORCID iD icon 3; Freude, Wolfgang 1,2; Koos, Christian 1,2
1 Institut für Photonik und Quantenelektronik (IPQ), Karlsruher Institut für Technologie (KIT)
2 Institut für Mikrostrukturtechnik (IMT), Karlsruher Institut für Technologie (KIT)
3 Institut für Angewandte Informatik (IAI), Karlsruher Institut für Technologie (KIT)

Abstract:

Photonic wire bonding is demonstrated to enable highly efficient coupling between multi-core fibers and planar silicon photonic circuits. The technique relies on in-situ fabrication of three-dimensional interconnect waveguides between the fiber facet and tapered silicon-on-insulator waveguides. Photonic wire bonding can easily compensate inaccuracies of core placement in the fiber cross-section, does not require active alignment, and is well suited for automated fabrication. We report on the design, on fabrication, and on characterization of photonic wire bonds. In a proof-of-principle experiment, a four-core fiber is coupled to a silicon photonic chip, leading to measured coupling losses as small as 1.7 dB.


Volltext §
DOI: 10.5445/IR/1000049613
Originalveröffentlichung
DOI: 10.1109/JLT.2014.2373051
Scopus
Zitationen: 117
Web of Science
Zitationen: 95
Dimensions
Zitationen: 114
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Informatik (IAI)
Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Universität Karlsruhe (TH) – Interfakultative Einrichtungen (Interfakultative Einrichtungen)
Karlsruhe Nano Micro Facility (KNMF)
Karlsruhe School of Optics & Photonics (KSOP)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2015
Sprache Englisch
Identifikator ISSN: 0733-8724, 1558-2213
urn:nbn:de:swb:90-496137
KITopen-ID: 1000049613
HGF-Programm 43.23.03 (POF III, LK 01) Teratronics
Erschienen in Journal of lightwave technology
Verlag Optica Publishing Group (OSA)
Band 33
Heft 4
Seiten 755-760
Projektinformation HYPHEN (EU, H2020, 680916)
Schlagwörter Integrated optics, nanotechnology, optical fibers, optical interconnections, waveguides, photonic wire bonding, two-photon lithography, silicon photonics, multi-core fibers
Nachgewiesen in Web of Science
Dimensions
Scopus
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